王儀雯 WANG, YI-WUN | 會議論文

會議論文

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學年期	標題	Sdgs	更新時間
109 / 1	Interconnections of Low-Temperature Solder and Metallizations	#07.可負擔的潔淨能源 #09.產業創新與基礎設施 #17.夥伴關係	2024-09-27
110 / 1	Microstructural Evolution of Low-Temperature Solder Joints	#07.可負擔的潔淨能源 #09.產業創新與基礎設施	2022-03-11
110 / 2	Interfacial Reactions of Low-Temperature Solder Joints	#07.可負擔的潔淨能源 #09.產業創新與基礎設施	2022-08-15
110 / 2	Microstructural observation of In-based solder joints	#04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施	2024-09-27
111 / 1	Sn52In與銅基板固液接合微結構觀察	#04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施	2024-09-27
111 / 1	Bi48In銲料與Cu基板焊接反應之微觀結構觀察	#04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施	2024-09-27
111 / 1	Microstructural Analyses of Sn58Bi and ENEPIG for Bonding Process	#04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施	2024-09-27
112 / 1	Low-temperature solder for low-carbon emitting process	#04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施	2025-02-04
112 / 2	Effects of Bi and In on the Growth of Intermetallic Compounds		2024-09-30
112 / 2	Effects of Storage Time on the Growth of Cu(In,Sn)2		2024-09-30
112 / 1	Interfacial Reactions of Sn52In on ENEPIG Substrates		2024-09-30
112 / 1	Adding Au and In to SnBi Solder on the Effectiveness of Inhibiting Bi Segregation		2024-09-30
112 / 2	低溫SnIn銲料界面接合反應之介金屬微結構研究		2024-09-30
113 / 1	Investigation of NiSn4 formation in the Reaction between SnBi Solder and ENEPIG Substrate		2025-02-12
113 / 1	Sn1Ga與Cu基板微觀結構觀察		2025-03-10
113 / 1	微量鎵添加至銲料中對介金屬生長之影響		2025-03-10

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