會議論文

學年期 標題 Sdgs 更新時間
109 / 1 Interconnections of Low-Temperature Solder and Metallizations #07.可負擔的潔淨能源 #09.產業創新與基礎設施 #17.夥伴關係 2024-09-27
110 / 1 Microstructural Evolution of Low-Temperature Solder Joints #07.可負擔的潔淨能源 #09.產業創新與基礎設施 2022-03-11
110 / 2 Interfacial Reactions of Low-Temperature Solder Joints #07.可負擔的潔淨能源 #09.產業創新與基礎設施 2022-08-15
110 / 2 Microstructural observation of In-based solder joints #04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施 2024-09-27
111 / 1 Sn52In與銅基板固液接合微結構觀察 #04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施 2024-09-27
111 / 1 Bi48In銲料與Cu基板焊接反應之微觀結構觀察 #04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施 2024-09-27
111 / 1 Microstructural Analyses of Sn58Bi and ENEPIG for Bonding Process #04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施 2024-09-27
112 / 1 Low-temperature solder for low-carbon emitting process #04.優質教育 #07.可負擔的潔淨能源 #09.產業創新與基礎設施 2024-09-27
112 / 2 Effects of Bi and In on the Growth of Intermetallic Compounds 2024-09-30
112 / 2 Effects of Storage Time on the Growth of Cu(In,Sn)2 2024-09-30
112 / 1 Interfacial Reactions of Sn52In on ENEPIG Substrates 2024-09-30
112 / 1 Adding Au and In to SnBi Solder on the Effectiveness of Inhibiting Bi Segregation 2024-09-30
112 / 2 低溫SnIn銲料界面接合反應之介金屬微結構研究 2024-09-30