Applying the selective Cu electroplating technique to light-emitting diodes
學年 102
學期 2
出版（發表）日期 2014-07-01
作品名稱 Applying the selective Cu electroplating technique to light-emitting diodes
作品名稱（其他語言）
著者 Hsu, Shih-Chieh; Chen, Lo-Lin; Lin, Cheng-Lan; Lin, Dar-Jong
單位 淡江大學化學工程與材料工程學系
出版者 Dordrecht: Springer Netherlands
著錄名稱、卷期、頁數 Research on Chemical Intermediates 40(6), pp.2347-2354
摘要 We successfully fabricated a predefined patterned copper (Cu) substrate for thin GaN light-emitting diodes without barriers by the selective electroplating technique. The contours of Cu bumps fabricated using different electroplating modes and parameters were measured. We observed that the average thickness diminished with increasing current density. The current density conditions to obtain the best upright structure in the process were 40 and 80 mA/cm2.
關鍵字 Electroplating; Selective electroplating; LED; GaN
 Cu bump
語言 en
ISSN 0922-6168
期刊性質 國外
收錄於 SCI
產學合作
通訊作者 Lin, Cheng-Lan
審稿制度 是
國別 NLD
公開徵稿
出版型式 紙本,電子版
相關連結

機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/99713 )

機構典藏連結