Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project
學年 98
學期 1
出版(發表)日期 2009-08-01
作品名稱 Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project
作品名稱(其他語言)
著者 Lee, Kuo-liang; Wei, Chun-chin; 李旭華; Lee, Hsu-hua
單位 淡江大學經營決策學系
出版者 Taylor & Francis
著錄名稱、卷期、頁數 Total Quality Management & Business Excellence 20(8), pp.863-876
摘要 As a well-structured methodology, Six Sigma enhances product quality by analysing data using statistical approaches to identify root causes of problems and implement effective control plans. This study presents a Six Sigma project at a printing circuit board (PCB) company illustrating how a Six Sigma project and statistical methods have been applied. The defect of exposed copper on annular rings during the developing process was examined. By using qualitative and quantitative tools in the define, measure, analyse, improve and control (DMAIC) methodology, the critical outputs, key point inputs and root causes were identified, analysed and verified. Additionally, a number of temporary and long-term control plans were developed to sustain and enhance the performance of the developing process. Finally, the benefits, experience, and extensions of the Six Sigma project were discussed.
關鍵字
語言 en
ISSN 1478-3363
期刊性質 國外
收錄於
產學合作
通訊作者
審稿制度
國別 GBR
公開徵稿
出版型式 ,電子版
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