A new silicon-mold process for polydimethylsiloxane microchannels
學年 112
學期 2
出版（發表）日期 2024-06-29
作品名稱 A new silicon-mold process for polydimethylsiloxane microchannels
作品名稱（其他語言）
著者 L.-J. Yang, S. Shaik, N.K. Unnam, V. Muthuraman
單位
出版者
著錄名稱、卷期、頁數 Micromachines, 15, 848
摘要 As an alternative to SU-8 soft lithography, a new silicon mold process of fabricating PDMS microchannel chips was proposed. A picosecond laser is used to cut through a 550 μm thick silicon wafer and generate the original microchannel pa􀄴ern with a 50 μm minimum feature size. This single-crystal silicon pa􀄴ern, with the edge debris caused by laser cu􀄴ing being trimmed off by a KOH solution and with the protection field oxide layer being removed by BOE afterwards, firmly resided on a glass substrate through the anodic bonding technique. Four-inch wafers with microchannel pa􀄴erns as the PDMS mold cores were successfully bonded on Pyrex 7740 or Eagle XG glass substrates for the follow-up PDMS molding/demolding process. This new maskless process does not need a photolithography facility, but the laser cu􀄴ing service must be provided by professional off-campus companies. One PDMS microchannel chip for particle separation was shown as an example of what can be achieved when using this new process.
關鍵字 PDMS microchannel; laser cu􀄴ing; anodic bonding
語言 en_US
ISSN 2072-666X
期刊性質 國外
收錄於 SCI Scopus
產學合作
通訊作者 L.-J. Yang
審稿制度 1
國別 CHE
公開徵稿
出版型式 ,電子版