Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints
學年 110
學期 2
出版（發表）日期 2022-07-13
作品名稱 Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints
作品名稱（其他語言）
著者 Y. W. Wang; G. W. Wu; T. T. Tseng; H. T. Liang
單位
出版者
著錄名稱、卷期、頁數 Journal of Materials Science: Materials in Electronics 33, p.18751-18757
摘要 Low-temperature solder is needed for temperature-sensitive components, step soldering and wearable devices. Low-temperature bonding is effective for reducing temperature and manufacturing costs. Indium has a low melting point, low resistance and good anticorrosion properties. Indium plays important roles in transparent conductors, the aerospace industry and flexible displays. Solid–liquid interdiffusion (SLID) bonding is one of the most reliable 3D integration technologies. The microstructure of the Cu/In/Ni bonding interface was investigated in this study. A low temperature of 180 C was used for SLID bonding. Cu-In compounds, Cu11In9 and CuIn2, were formed after SLID bonding at 180 C and storing at room temperature. The reaction between Cu and In is fast, even at room temperature. The low-temperature CuIn2 phase is undoubtedly worth investigating for solder joints.
關鍵字
語言 en
ISSN 1573-482X; 0957-4522
期刊性質 國外
收錄於 SCI
產學合作
通訊作者 Y. W. Wang
審稿制度 是
國別 NLD
公開徵稿
出版型式 ,電子版,紙本
SDGS 可負擔的潔淨能源,尊嚴就業與經濟發展,產業創新與基礎設施