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摘要
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The compositions of solders play an important role for joint performance including microstructures and bonding temperature. The melting temperature of commercial lead-free solders is higher than Pb-bearing solders. It means the requirement of high temperature processes. Global warming nowadays becomes more and more serious. Energy saving is a popular subject for investigation. On the other hand, the plastic substrates could not sustain the high temperature processes that induced warpage and thermal damage. In this study, the low-temperature solders SnIn, SnBi and BiIn were investigated for low-temperature solder development. Low-temperature processes is environment-friendly. Solid-state, solid-liquid reactions and mechanical properties of intermetallic compounds carried out by using SEM, EPMA and nanoindenter. The strength of solder joint is crucial for reliability. The intermetallic compounds growth directly influence the joint strength. The microstructural evolutions of Cu6Sn5, Cu3Sn, Cu11In9, and CuIn2 would be discussed in this study. No doubt the results are practical for flexible electronics. |
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