教師資料查詢 | 類別: 會議論文 | 教師: 王儀雯WANG, YI-WUN (瀏覽個人網頁)

標題:Interfacial Reactions of Low-Temperature Solder Joints
學年110
學期2
發表日期2022/05/27
作品名稱Interfacial Reactions of Low-Temperature Solder Joints
作品名稱(其他語言)
著者Y. W. Wang
作品所屬單位
出版者
會議名稱International Conference on Frontier Materials 2022
會議地點珠海,中國
摘要The compositions of solders play an important role for joint performance including microstructures and bonding temperature. The melting temperature of commercial lead-free solders is higher than Pb-bearing solders. It means the requirement of high temperature processes. Global warming nowadays becomes more and more serious. Energy saving is a popular subject for investigation. On the other hand, the plastic substrates could not sustain the high temperature processes that induced warpage and thermal damage. In this study, the low-temperature solders SnIn, SnBi and BiIn were investigated for low-temperature solder development. Low-temperature processes is environment-friendly. Solid-state, solid-liquid reactions and mechanical properties of intermetallic compounds carried out by using SEM, EPMA and nanoindenter. The strength of solder joint is crucial for reliability. The intermetallic compounds growth directly influence the joint strength. The microstructural evolutions of Cu6Sn5, Cu3Sn, Cu11In9, and CuIn2 would be discussed in this study. No doubt the results are practical for flexible electronics.
關鍵字Microstructures;Global warming;Low-temperature solder
語言英文(美國)
收錄於
會議性質國際
校內研討會地點
研討會時間20220527~20220531
通訊作者
國別中國
公開徵稿
出版型式
出處
SDGs
  • 可負擔的潔淨能源,產業創新與基礎設施
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