INVESTIGATION ON THE DEGREE OF ASSEMBLY FOR COMPONENTS IN AN INJECTION FAMILY MOLD SYSTEM
學年 109
學期 2
出版（發表）日期 2021-05-11
作品名稱 INVESTIGATION ON THE DEGREE OF ASSEMBLY FOR COMPONENTS IN AN INJECTION FAMILY MOLD SYSTEM
作品名稱（其他語言）
著者 Tsai-Wen Lin; Chao-Tsai Huang; Wen-Ren Jong; Shia-Chung Chen
單位
出版者
著錄名稱、卷期、頁數 SPE Technical Papers, ANTEC2021
摘要 The main target for Design for Manufacturing and Assembly (DFMA) is to integrate multiple components with multiple functions to minimize cost and efforts. In addition, a family mold system has been utilized in industrial manufacturing to make a series integrated components for years. However, there is very few information to the degree of assembly for a single component or components. In this study, the degree of assembly using a family mold system with two different components has been investigated. The study methods include numerical simulation and experimental observation. Firstly, the packing pressure is adopted as the practical operation parameter to affect the variation of degree of assembly. Then the pre-defined characteristic lengths were utilized to catch the degree of assembly. Results showed that when a higher packing pressure applied in injection molding, it will results in more difficulty in the assembly for Part A and B by numerical prediction. Furthermore, the experimental validation on the degree of assembly based on the characteristic lengths has also performed. The tendency is quite consistent for both numerical simulation and experimental estimation. However, there is some gap between simulation prediction and experimental measurement for the same operation condition setting. To reduce that gap, future work is planned.
關鍵字 Family mold;degree of assembly;CAE simulation
語言 en_US
ISSN
期刊性質 國外
收錄於 EI
產學合作
通訊作者 Chao-Tsai Huang
審稿制度 是
國別 USA
公開徵稿
出版型式 ,電子版
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