教師資料查詢 | 類別: 期刊論文 | 教師: 王儀雯WANG, YI-WUN (瀏覽個人網頁)

標題:Phase Characterization of Interfacial Reactions in the Ni/In/Cu Ternary System
學年109
學期1
出版(發表)日期2021/01/08
作品名稱Phase Characterization of Interfacial Reactions in the Ni/In/Cu Ternary System
作品名稱(其他語言)
著者Y.W. Wang
單位
出版者
著錄名稱、卷期、頁數Journal of Materials Science: Materials in Electronics, vol. 32, pp. 4205-4213
摘要This study focuses on the characterization of the Ni/In/Cu microstructure. Ni and Cu are chosen because they are common materials in electronic devices, and In is one of the elements in commercial solders. The benefit of this joining process is the production of a bond at a low temperature. However, knowledge of the behaviors of the Ni/In/Cu ternary system at low temperatures is lacking due to issues with sample preparation. In this study, reactions at low temperatures and in the presence of a thin In layer are discussed. The interfacial reactions of Ni/In/Cu are systematically investigated to provide information about low-temperature reactions that involve the interdiffusion of a thin In layer. The results of this study show that (Cu,Ni)In2 is a stable phase below 100 °C and (Cu,Ni)11In9 is a dominant phase between 120 °C and 180 °C. In addition, a thin layer of (Ni,Cu)3In7 forms near the Ni side. The sequential microstructural evolution, such as microvoid growth and phase transformations, are discussed in this study.
關鍵字
語言英文(美國)
ISSN1573-482X
期刊性質國外
收錄於SCI;
產學合作
通訊作者Y.W.Wang (王儀雯)
審稿制度
國別荷蘭
公開徵稿
出版型式,電子版
相關連結
SDGs
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