A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes
學年 93
學期 1
發表日期 2005-01-30
作品名稱 A liquid-based gravity-driven etching-stop technique and its application to wafer level cantilever thickness control of AFM probes
作品名稱（其他語言）
著者 Lin, Wei-chih; Liang, Chao-chiun; Tsai, Ching-hsiang; Hsieh, Gen-wen; 楊龍杰; Yang, Lung-jieh
作品所屬單位 淡江大學機械與機電工程學系
出版者 Piscataway: Institute of Electrical and Electronics Engineers (IEEE)
會議名稱 Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
會議地點 Miami Beach, FL, USA
摘要 This paper mainly describes a liquid based gravity driven etching stop technique used for cantilever thickness control of atomic force microscope (AFM) probes on the wafer level. The technique makes use of the method of opposite etching trenches or the depth rulers. A pair of opposite trenches surrounds several AFM probes on both sides of the wafer to form probe chips. The trench depth on the cantilever front side is equal to the designed thickness of cantilevers. In the final step of the fabrication process for AFM probes, the wafer is etched by the KOH etchant to form the probe handles. The probe chips will be separated from the wafer simultaneously with the penetration of wafers at the trenches. The separated probes fall into the diiodomethane (CH2I2) solution beneath the KOH etchant and the wet etching stops automatically. The cantilever thickness of the AFM probes can then be wafer level controlled by the proposed etching stop technique.
關鍵字
語言 en
收錄於
會議性質 國際
校內研討會地點
研討會時間 20050130~20050203
通訊作者
國別 USA
公開徵稿
出版型式
出處 Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on, pp.500-503
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