Performance Testing of Micro Loop Heat Pipes
學年 93
學期 2
出版(發表)日期 2005-06-01
作品名稱 Performance Testing of Micro Loop Heat Pipes
著者 Hsu, Chin-chun; 康尚文; Kang, Shung-wen; Hou, Tung-fu
單位 淡江大學機械與機電工程學系
出版者 淡江大學
著錄名稱、卷期、頁數 淡江理工學刊=Tamkang Journal of Science and Engineering 8(2), pp.123-132
摘要 A 60 mm 33 mm  0.8 mm micro loop heat pipe (MLHP), consisting of an evaporator, vapor line, condenser and two liquid lines, was fabricated and characterized. The wicking structure consists of parallel V-grooves with a hydraulic diameter of 47 m, 67 m and 83 m, and is formed by bulk silicon etching. The MLHP was realized by bonding a glass wafer onto a silicon substrate, so as to result in a transparent cover for two-phase flow visualization. Water and methanol were used as the working fluids. The test results showed that water demonstrates a wider heat load performance range (3.3 W~12.96 W) than methanol (1.2 W~5.85 W) for the MLHP with an evaporator area of 1 cm2 and condenser temperature of 17 C. The best thermal resistance of the MLHP was 0.106 C/W, 64 times higher than that without fluid filling. The smaller diameter grooves caused the higher liquid capillarity and enhanced transfer capacity. It was observed that the presence of non-condensable gas negatively affected the reliability of the MLHP and significantly reduced the performance.
語言 en
ISSN 1560-6686
期刊性質 國內
國別 TWN
出版型式 ,電子版

機構典藏連結 ( )