教師資料查詢 | 類別: 期刊論文 | 教師: 康尚文KANG SHUNG-WEN (瀏覽個人網頁)

標題:Improvement of thickness uniformity in nickel electroforming for the LIGA process
學年88
學期2
出版(發表)日期2000/05/01
作品名稱Improvement of thickness uniformity in nickel electroforming for the LIGA process
作品名稱(其他語言)
著者Yang, Hsiharng; 康尚文; Kang, Shung-wen
單位淡江大學機械與機電工程學系
出版者Elsevier
著錄名稱、卷期、頁數international journal of machine tools and manufacture 40(7), pp.1065-1072
摘要An effective method to improve thickness uniformity in nickel electroforming for the LIGA process to produce metallic microstructures is described. The deposited metal distribution is naturally a concave shape over the whole area of the plating base proved by experiments. The edge thickness of the plating area is usually twice or higher than the center of the plating area. A secondary cathode (guard ring) was applied to improve the electroform uniformity. The experimental result of a Joule–Thomson micro-cooler proved its feasibility. The thickness ratio of edge to center of a 500 μm sample decreased from 2.5 to 1.4. The thickness uniformity improvement is achieved without a loss in plating rate in the center of the features.
關鍵字Thickness uniformity; Nickel electroforming; LIGA; Metallic microstructures
語言英文
ISSN0890-6955
期刊性質國內
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產學合作
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審稿制度
國別中華民國
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