教師資料查詢 | 類別: 會議論文 | 教師: 田 豐TYAN FENG (瀏覽個人網頁)

標題:Non-Uniformity of Wafer and Pad in CMP: Kinematic Aspects of View
學年93
學期2
發表日期2005/06/08
作品名稱Non-Uniformity of Wafer and Pad in CMP: Kinematic Aspects of View
作品名稱(其他語言)
著者Tyan, Feng
作品所屬單位淡江大學航空太空工程學系
出版者
會議名稱American Control Conference 2005 (ACC 2005)
會議地點Portland, USA
摘要In this paper, we analyze the non-uniformity of sliding distance on both wafer and polishing pad from kinematic point of view. Using the Fourier series expansion, we can show that in steady state the non-uniformity is determined by the ratio between rotary speeds of platen and wafer carrier (m), and the ratio of wafer radius to the distance between the center of platen and wafer (Rc/d). In general, the non-uniformity of wafer increases with |m| and Rc/d. An important observation for polishing pad is that in two particular ranges of the ratio m, the larger Rc/d produces the smaller non-uniformity. Then a ring type polishing pad is proposed for the purpose of improving the non-uniformity of both wafer and pad. However, it turns out that the result is much worse than we expected.
關鍵字
語言英文
收錄於
會議性質國際
校內研討會地點
研討會時間20050608~20050610
通訊作者
國別美國
公開徵稿Y
出版型式
出處American Control Conference, 2005. Proceedings of the 2005, v.3, pp.2046-2051
相關連結
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