Study of Thickness and Grain Size Effects on Material Behavior in Micro Forming
學年 96
學期 1
發表日期 2007-10-07
作品名稱 Study of Thickness and Grain Size Effects on Material Behavior in Micro Forming
作品名稱（其他語言）
著者 Yeh, Fung-Huei; Li, Ching-Lun; Lu, Yuung-Hwa
作品所屬單位 淡江大學機械與機電工程學系
出版者 Daejeon: The Korea Advanced Institute of Science and Technology
會議名稱 The 10th International Conference on Advances in Materials and Processing Technologies (AMPT2007)
會議地點 Daejeon, KOREA
摘要 With the development of the technology, miniature and portability become the trends in manufacturing business. It is more and more important to miniaturize blank size in micro-forming process as well. Therefore, the researchers of micro-forming focus on this trend and try their best to study the problems and find the best solution. This paper presents an effective and practical mathematical modeling to describe the material behavior of any thickness and any grain size in micro-forming. Using this modeling, the cylindrical micro-cup deep drawing is analyzed by explicit dynamic finite element method. The simulation results show that thickness variety and stress distribution are reasonable. This investigation proves that the new mathematical modeling of material behavior will supply a useful modeling which takes into account the thickness and grain size effects in micro-forming.
關鍵字 thickness;grain size;material behavior;micro-forming
語言 en
收錄於
會議性質 國際
校內研討會地點
研討會時間 20071007~20071011
通訊作者
國別 KOR
公開徵稿 Y
出版型式
出處 Proceedings of 10th International Conference on Advances in Materials and Processing Technologies (AMPT2007), 5p.
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