Heat Transfer Prediction of Recycle Effect for Improved Device Performance in Cool-Thermal Discharge Systems
學年 96
學期 2
出版（發表）日期 2008-07-02
作品名稱 Heat Transfer Prediction of Recycle Effect for Improved Device Performance in Cool-Thermal Discharge Systems
作品名稱（其他語言）
著者 Ho, Chii-Dong; Huang, Jun-Wei; Tu, Jr-Wei
單位 淡江大學化學工程與材料工程學系
出版者 Philadelphia: Taylor & Francis Inc.
著錄名稱、卷期、頁數 Numerical Heat Transfer, Part A: Applications 54(7), pp.709-725
摘要 This research studies the heat transfer characteristic of an unsteady close-contact melting on a flat plate in the cool-thermal discharge systems with external recycle, develops the mathematical model theoretically to simulate the conduction-convection heat-transfer phenomena, and calculates the theoretical prediction of the outlet chilled air temperature by solving the energy balance associated with integral boundary-layer analysis. It is found that the recycle effect can enhance the average Nusselt numbers and heat-transfer efficiency improvement effectively. Three numerical examples of inlet ambient air temperature are illustrated to compute the chilled air temperature, average Nusselt numbers and heat-transfer efficiency with three specified volumetric flow rate and three traversed length of the ambient inlet air as parameters.
關鍵字
語言 en_US
ISSN 1040-7782 1521-0634
期刊性質 國外
收錄於 SCI EI
產學合作
通訊作者 Ho, Chii-Dong
審稿制度 否
國別 USA
公開徵稿
出版型式 ,電子版,紙本
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