Micro pressure sensor with submillimeter size by the silicon bulk micromachining
學年 88
學期 1
發表日期 1999-09-20
作品名稱 Micro pressure sensor with submillimeter size by the silicon bulk micromachining
作品名稱（其他語言）
著者 楊龍杰; Yang, Lung-jieh; Chang, Y. M.
作品所屬單位 淡江大學機械與機電工程學系
出版者
會議名稱
會議地點
摘要 This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer substitutes the role of the silicon wafer itself. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the (111)-face slopes. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing principles and the different techniques of membrane machining. The on-chip circuitry of sensors could be also preserved. Another important issue is that the surface- machining-link membrane now is mono-crystalline, which means the stable mechanical properties and reproducible characteristics. This new strategy practically augmented the mass production of piezoresistive pressure sensors using in tire pressure gauges and other industrial pressure meters. The 1.0 mm X 0.8 mm X 0.5 mm of sensor size with chip density exceeds 5,000 per 4-inch wafer was successfully fabricated. Some engineering applications used this new pressure sensor to solve their corresponding problems.
關鍵字
語言 en
收錄於
會議性質 國內
校內研討會地點
研討會時間 19990920~19990920
通訊作者
國別
公開徵稿
出版型式
出處 SPIE's symp. on micromachining and microfabrication v.3876-32
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