Hot embossing auto-leveling apparatus and method | |
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學年 | 91 |
學期 | 2 |
專利開始日期 | 2003-03-20 |
專利結束日期 | 2003-03-20 |
作品名稱 | Hot embossing auto-leveling apparatus and method |
作品名稱(其他語言) | |
著者 | 趙崇禮; Chao, Choung-lii; Huang; Jung-yan; Tsai, Chu-shu; Mu, Chuan-kang; Yang, Jauh-jung; Huang, Cheng-chun ; Liu, Ming-yueh |
單位 | 淡江大學機械與機電工程學系 |
著錄名稱、卷期、頁數 | |
描述 | United States Patent: 7,114,941 Application number: 10/393,891 國際分類號:B29C 59/02 專利國別:美國 |
摘要 | A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening. |
關鍵字 | |
語言 | en |
相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/53861 ) |
SDGS | 產業創新與基礎設施 |