期刊論文
| 學年 | 114 |
|---|---|
| 學期 | 1 |
| 出版（發表）日期 | 2025-10-21 |
| 作品名稱 | Intermixing of Sn3Ag0.5Cu solder balls and Sn52In solder paste for interconnection |
| 作品名稱（其他語言） | |
| 著者 | Yi‑Wun Wang; Kai‑Lin Cheng; Yu‑Ming Chen; Xiang‑Ting Lin; Jang‑Cheng Fang |
| 單位 | |
| 出版者 | |
| 著錄名稱、卷期、頁數 | Journal of Materials Science: Materials in Electronics 36, p. 1904 |
| 摘要 | As semiconductor technology advances, products are evolving toward higher performance and miniaturization. Moreover, global warming and climate change have considerably affected human life, making the development of low-temperature lead-free solder an important research topic. Sn3Ag0.5Cu solder balls were combined with low-temperature solder paste for energy efficiency. The process temperature was reduced by intermixing Sn3Ag0.5Cu solder balls and Sn52In solder paste. The mixed-assembly Sn3Ag0.5Cu/Sn52In solder joint was fabricated at a lower bonding temperature. This study presents an investigation of a composite solder system comprising medium–high-temperature lead-free solder Sn3Ag0.5Cu and a low-temperature lead-free solder Sn52In, which was bonded to an ENIG substrate. The microstructure and shear strength of the hybrid solder were examined. Sn52In low-temperature solder paste combined with Sn3Ag0.5Cu ball-grid-array (BGA) solder balls was used to reduce the process temperature. It enables the reflow process to occur at temperatures 155 ℃, compared to the typical 250 ℃ for standard SnAgCu solders. This reduction in temperature minimizes thermal stress on sensitive components and substrates, improving overall assembly reliability. The experimental results revealed that at 60 ℃, due to insufficient Cu content in the solder joint, heterogeneous nucleation resulted in discontinuous (Cu,Ni)6(Sn,In)5 in regions with relatively high Cu concentrations. At 80 ℃, the discontinuous (Cu,Ni)6(Sn,In)5 gradually transformed into a layered structure over time, and after 2000 h of aging, the reduction in the Cu content led to the transformation of (Cu,Ni)6(Sn,In)5 into (Ni,Cu)(Sn,In)2. At 130 ℃, after 1000 h of reaction, rapid intermetallic growth caused the surface treatment layer to fully react, resulting in failure. The ball shear test results revealed that the hybrid solder had a weak shear strength, with brittle fractures observed across all the tested samples. The shear stress decreased as a dual-layer intermetallic structure formed at the interface. |
| 關鍵字 | |
| 語言 | en_US |
| ISSN | |
| 期刊性質 | 國外 |
| 收錄於 | SCI |
| 產學合作 | |
| 通訊作者 | |
| 審稿制度 | 是 |
| 國別 | DEU |
| 公開徵稿 | |
| 出版型式 | ,電子版 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/128535 ) |