期刊論文
| 學年 | 112 |
|---|---|
| 學期 | 1 |
| 出版（發表）日期 | 2023-10-12 |
| 作品名稱 | Study on the growth mechanisms of Cu‑In compounds at the Sn52In/Cu interface |
| 作品名稱（其他語言） | |
| 著者 | Wang, Yi‑wun |
| 單位 | |
| 出版者 | |
| 著錄名稱、卷期、頁數 | Journal of Materials Science: Materials in Electronics 34, 1983 |
| 摘要 | Climate change and global temperature increases both impact the environment, as seen through rising sea levels and the food crises. Emissions of carbon dioxide should be reduced to values as close to zero as possible by 2050. Manufacturers require large amounts of energy to produce electronic products. Flexible devices are some of the most popular electronic products. Advanced materials in the field of flexible devices are highly convenient. Electric and thermal conductivity are important properties for electronic devices. Low-temperature Sn52In is used in this study to effectively decrease the bonding temperature. The aim of this study is to investigate the reaction of eutectic Sn52In solder with Cu for low-temperature bonding and aging reactions. In addition, the storage time of In-based solder is extremely important because of the rapid reactions of Cu and In to form CuIn2 at room temperature. CuIn2 formation after room temperature storage possibly causes useless bonding. Failure joints occur due to In (solder) shortage time. |
| 關鍵字 | |
| 語言 | en |
| ISSN | |
| 期刊性質 | 國外 |
| 收錄於 | SCI |
| 產學合作 | |
| 通訊作者 | Wang, Yi-wun |
| 審稿制度 | 是 |
| 國別 | DEU |
| 公開徵稿 | |
| 出版型式 | ,電子版 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/124637 ) |