期刊論文
| 學年 | 101 |
|---|---|
| 學期 | 1 |
| 出版（發表）日期 | 2012-10-18 |
| 作品名稱 | Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC |
| 作品名稱（其他語言） | |
| 著者 | Shih, Chi-Jih; Hsu, Chih-Yao; Kuo, Chun-Yi; Li, James; Rau, Jiann-Chyi; Krishnendu Chakrabarty |
| 單位 | 淡江大學電機工程學系 |
| 出版者 | New York: Hindawi Publishing |
| 著錄名稱、卷期、頁數 | Active and Passive Electronic Components 2012, 763572 |
| 摘要 | Testing is regarded as one of the most difficult challenges for three-dimensional integrated circuits (3D ICs). In this paper, we want to optimize the cost of TAM (test access mechanism) and the test time for 3D IC. We used both greedy and simulated annealing algorithms to solve this optimization problem. We compare the results of two assumptions: soft-die mode and hard-die mode. The former assumes that the DfT of dies cannot be changed, while the latter assumes that the DfT of dies can be adjusted. The results show that thermal-aware cooptimization is essential to decide the optimal TAM and test schedule. Blindly adding TAM cannot reduce the total test cost due to temperature constraints. Another conclusion is that soft-die mode is more effective than hard-die mode to reduce the total test cost for 3D IC. |
| 關鍵字 | |
| 語言 | en_US |
| ISSN | 1563-5031 |
| 期刊性質 | 國外 |
| 收錄於 | EI |
| 產學合作 | |
| 通訊作者 | Chi-Jih Shih; terrys47@hotmail.com |
| 審稿制度 | 是 |
| 國別 | USA |
| 公開徵稿 | |
| 出版型式 | ,電子版 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/80543 ) |