期刊論文
學年 | 96 |
---|---|
學期 | 2 |
出版(發表)日期 | 2008-07-02 |
作品名稱 | Heat Transfer Prediction of Recycle Effect for Improved Device Performance in Cool-Thermal Discharge Systems |
作品名稱(其他語言) | |
著者 | Ho, Chii-Dong; Huang, Jun-Wei; Tu, Jr-Wei |
單位 | 淡江大學化學工程與材料工程學系 |
出版者 | Philadelphia: Taylor & Francis Inc. |
著錄名稱、卷期、頁數 | Numerical Heat Transfer, Part A: Applications 54(7), pp.709-725 |
摘要 | This research studies the heat transfer characteristic of an unsteady close-contact melting on a flat plate in the cool-thermal discharge systems with external recycle, develops the mathematical model theoretically to simulate the conduction-convection heat-transfer phenomena, and calculates the theoretical prediction of the outlet chilled air temperature by solving the energy balance associated with integral boundary-layer analysis. It is found that the recycle effect can enhance the average Nusselt numbers and heat-transfer efficiency improvement effectively. Three numerical examples of inlet ambient air temperature are illustrated to compute the chilled air temperature, average Nusselt numbers and heat-transfer efficiency with three specified volumetric flow rate and three traversed length of the ambient inlet air as parameters. |
關鍵字 | |
語言 | en_US |
ISSN | 1040-7782 1521-0634 |
期刊性質 | 國外 |
收錄於 | SCI EI |
產學合作 | |
通訊作者 | Ho, Chii-Dong |
審稿制度 | 否 |
國別 | USA |
公開徵稿 | |
出版型式 | ,電子版,紙本 |
相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/65513 ) |