教師資料查詢 | 類別: 期刊論文 | 教師: 李旭華 HSU-HUA LEE (瀏覽個人網頁)

標題:Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project
學年98
學期1
出版(發表)日期2009/08/01
作品名稱Reducing exposed copper on annular rings in a PCB factory through implementation of a Six Sigma project
作品名稱(其他語言)
著者Lee, Kuo-liang; Wei, Chun-chin; 李旭華; Lee, Hsu-hua
單位淡江大學經營決策學系
出版者Taylor & Francis
著錄名稱、卷期、頁數Total Quality Management & Business Excellence 20(8), pp.863-876
摘要As a well-structured methodology, Six Sigma enhances product quality by analysing data using statistical approaches to identify root causes of problems and implement effective control plans. This study presents a Six Sigma project at a printing circuit board (PCB) company illustrating how a Six Sigma project and statistical methods have been applied. The defect of exposed copper on annular rings during the developing process was examined. By using qualitative and quantitative tools in the define, measure, analyse, improve and control (DMAIC) methodology, the critical outputs, key point inputs and root causes were identified, analysed and verified. Additionally, a number of temporary and long-term control plans were developed to sustain and enhance the performance of the developing process. Finally, the benefits, experience, and extensions of the Six Sigma project were discussed.
關鍵字
語言英文
ISSN1478-3363
期刊性質國外
收錄於
產學合作
通訊作者
審稿制度
國別英國
公開徵稿
出版型式,電子版
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