教師資料查詢 | 類別: 會議論文 | 教師: 王儀雯WANG, YI-WUN (瀏覽個人網頁)

標題:Interconnections of Low-Temperature Solder and Metallizations
學年109
學期1
發表日期2020/09/15
作品名稱Interconnections of Low-Temperature Solder and Metallizations
作品名稱(其他語言)
著者Y.W.Wang, C. R. Kao
作品所屬單位
出版者
會議名稱2020 Electronics System-Integration Technology Conference
會議地點online
摘要The development of solder is from Pb-bearing to
Pb-free solder because of toxin. Nowadays, Sn-based solder is usually chosen as the prime materials in electronic packaging. However, the melting point of Sn-based solder is higher than Pb bearing solder about 40 oC. High process temperature causes the
side effects on devices such as warpage, crack and damage. Requiring the melting point of solder is below 200 oC to overcome thermal budget. In is a good candidate to replace Sn owing to its good mechanical properties. Recently, a Cu/In structure is developed for 3D integration applications.
Nevertheless, fewer researches investigate low temperature reaction between Cu and In. Previous literature of Cu-In interfacial reactions were focused on thick In layer and high temperature reactions. Studying thin In layer and low temperature reactions are important for 3D IC integration. Microstructure evolution of Cu-In compounds at lowtemperature
are regarded as useful database for interfacial
reaction. This study not only concentrates on Cu/In reaction but also discusses deeply the reaction between Cu, In and Ni. Electroplating In layer on Cu metallization and subsequently electroplating Ni on In. The electroplating procedure is one of the major challenges because of the rapid diffusion of Cu and In.
Microstructure observation are from 100 oC to 140 oC. The samples were mounted in epoxy resin and ground with SiC paper and Al2O3 powders. The reaction zone was observed using an optical microscope and a scanning electron microscope (SEM). The compositions of Cu-In and Ni-In compounds were
determined using an electron microprobe (FE-EPMA). The main results were as follows: (1) (Cu,Ni)In2 formation after electroplating, (2) (Cu,Ni)In2 is stable at 100 oC, (3) (Cu,Ni)11In9 is dominant phase at 140 oC, (4) Microvoids within (Cu,Ni)11In9 and (Ni,Cu)3In7 formation at 120 oC. The result provides detailed Cu-In compounds development and key findings related to the reliability of In-based solder. This study presents
the growth of intermetallic compounds in Cu/In/Ni scheme resulting from aging at 100 oC and 140 oC.
關鍵字low-temperature process;In-based solder;Cu-In- Ni compounds;microvoids
語言英文(美國)
收錄於
會議性質國際
校內研討會地點
研討會時間20200915~20200918
通訊作者Y.W.Wang (王儀雯)
國別挪威
公開徵稿
出版型式
出處IEEE
相關連結
SDGs
  • 可負擔的潔淨能源,產業創新與基礎設施,夥伴關係
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