教師資料查詢 | 類別: 期刊論文 | 教師: 王儀雯 WANG, YI-WUN (瀏覽個人網頁)

標題:Phase stabilities and interfacial reactions of the Cu–In binary systems
學年108
學期2
出版(發表)日期2020/05/12
作品名稱Phase stabilities and interfacial reactions of the Cu–In binary systems
作品名稱(其他語言)
著者Y. F. Lin; H. T. Hung; H. Y. Yu; C. R. Kao; Y. W. Wang
單位
出版者
著錄名稱、卷期、頁數Journal of Materials Science: Materials in Electronics 31, p.10161-10169
摘要The Cu–In binary system is receiving increasing attention due to its application in the low-temperature assembly of heat sensitive devices. Nevertheless, the fundamental behaviors of this binary system are very difficult to study because of the extreme softness of indium. This difficulty was successfully overcome in this study, and the phase stabilities and chemical
reactions were established. Binary Cu–In diffusion couples were prepared by electroplating In onto a Cu substrate. During the plating process, CuIn2
formed even though this intermetallic is not present in the Cu–In binary phase diagram. It was established in this study that CuIn2 is indeed a stable phase below 100 °C, but decomposes at a temperature between 100 and 120 °C. In addition, the microstructure evolution during solid-state aging at 100, 120, and 140 °C was investigated. The hardness values and Young’s moduli for CuIn2 and Cu11In9 were measured by using nanoindentation.
關鍵字
語言英文
ISSN1573-482X
期刊性質國外
收錄於SCI;
產學合作
通訊作者Y.W.Wang (王儀雯)
審稿制度
國別荷蘭
公開徵稿
出版型式,電子版
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