教師資料查詢 | 類別: 會議論文 | 教師: 趙崇禮 CHAO CHOUNG-LII (瀏覽個人網頁)

標題:Study on fabricating of micro-pyramid array by precision diamond turning
學年101
學期2
發表日期2013/04/09
作品名稱Study on fabricating of micro-pyramid array by precision diamond turning
作品名稱(其他語言)
著者Chao, Choung-Lii; Lin, Wen-Chung; Chou, Wen-Chen; Ko, Jui-Ling; Ma, Kung-Jeng; Chao, Chung-Woei
作品所屬單位淡江大學機械與機電工程學系
出版者SPIE
會議名稱International Conference on Optics in Precision Engineering and Nanotechnology (icOPEN2013)
會議地點Singapore
摘要As the demand for micro-patterned parts getting bigger, the need for molds with micro/nano scaled patterns to duplicate these parts effectively and economically is increasing ever so rapidly. Over the years, numerous attempts have been made to fabricate these molds using various approaches such as lithography, FIB, laser ablation, and precision diamond turning. Amongst these approaches, diamond turning is by far the most commonly used method to generate the micropatterned rollers for roll-to-roll fabricating of precision optical parts such as BEF and 3D films. However, micro-burrs are frequently produced during the micro-cutting process which not only makes the mold un-usable but also increases the cost of machining. Efforts have been made to study the burr formation process during the micro-cutting by FEM simulation, micro-scratching and diamond turning. Influences of the machining parameters such as rake angle, cutting edge radius, included angle and cutting speed on the burr formation were systematically investigated. Array of micropyramids with 90° apex angle, 40*40μm2 basal area and minimised burr were successfully produced on a OFCu roller of 270mm in diameter. The results showed that (i) tool rake angle, included angle and cutting edge radius have profound effect on burr formation and achievable surface finish, (ii) simulation can supply very useful information for setting the machining parameters to suppress the burr formation during micro-cutting process.
關鍵字
語言英文(美國)
收錄於EI
會議性質
校內研討會地點
研討會時間20130409~20130411
通訊作者Chao, Choung-Lii
國別新加坡
公開徵稿Y
出版型式
出處Proc. SPIE 8769
相關連結
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