教師資料查詢 | 類別: 期刊論文 | 教師: 林達鎔 LIN, DAR-JONG (瀏覽個人網頁)

標題:Applying the selective Cu electroplating technique to light-emitting diodes
學年102
學期2
出版(發表)日期2014/07/01
作品名稱Applying the selective Cu electroplating technique to light-emitting diodes
作品名稱(其他語言)
著者Hsu, Shih-Chieh; Chen, Lo-Lin; Lin, Cheng-Lan; Lin, Dar-Jong
單位淡江大學化學工程與材料工程學系
出版者Dordrecht: Springer Netherlands
著錄名稱、卷期、頁數Research on Chemical Intermediates 40(6), pp.2347-2354
摘要We successfully fabricated a predefined patterned copper (Cu) substrate for thin GaN light-emitting diodes without barriers by the selective electroplating technique. The contours of Cu bumps fabricated using different electroplating modes and parameters were measured. We observed that the average thickness diminished with increasing current density. The current density conditions to obtain the best upright structure in the process were 40 and 80 mA/cm2.
關鍵字Electroplating; Selective electroplating; LED; GaN ;
Cu bump
語言英文
ISSN0922-6168
期刊性質國外
收錄於SCI;
產學合作
通訊作者Lin, Cheng-Lan
審稿制度
國別荷蘭
公開徵稿
出版型式紙本,電子版
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