教師資料查詢 | 類別: 期刊論文 | 教師: 康尚文 KANG SHUNG-WEN (瀏覽個人網頁)

標題:Analysis of Thermal Resistance Characteristics of Power LED Module
學年102
學期1
出版(發表)日期2014/01/01
作品名稱Analysis of Thermal Resistance Characteristics of Power LED Module
作品名稱(其他語言)
著者Wang, Chien-Ping; Kang, Shung-Wen; Lin, Kuan-Min; Chen, Tzung-Te; Fu, Han-Kuei; Chou, Pei-Ting
單位淡江大學機械與機電工程學系
出版者New York: Institute of Electrical and Electronics Engineers
著錄名稱、卷期、頁數IEEE Transactions on Electron Devices 61(1), pp.105-109
摘要Multichip LED arrays are widely used for lighting to provide high luminance. Luminous efficacy, lifetime, and color temperature are highly dependent on the temperature at p-n junction. This paper investigated the effects of distance, number of chips, and driving current on the thermal resistance of LED module. Thermal resistance dramatically increased as the distance between LED chips decreased due to significant thermal spreading impedance for heat dissipation from junction to ambient. The parallel-resistance formula substantially underestimated the junction temperature of the LED modules due to significant thermal crowding effect. Thermal boundary can also rise junction temperature as the distance to the board edge decreased in both the two-chip and four-chip modules. Infrared results showed that chip temperatures were highly consistent with thermal resistance measurements under different driving currents.
關鍵字Junction temperature; LED module; thermal resistance
語言英文(美國)
ISSN0018-9383
期刊性質
收錄於SCI;
產學合作
通訊作者
審稿制度
國別美國
公開徵稿
出版型式紙本;
相關連結
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