教師資料查詢 | 類別: 會議論文 | 教師: 蔡孟昌 TSAI MENG-CHANG (瀏覽個人網頁)

標題:Development of Thermal Spreading Technology Nowadays
學年98
學期1
發表日期2009/10/21
作品名稱Development of Thermal Spreading Technology Nowadays
作品名稱(其他語言)
著者Kang, Shung-wen; Tsai, Meng-chang; Weng, Ming-tai; Hsu, Chao-hsiang
作品所屬單位淡江大學機械與機電工程學系
出版者IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei)
會議名稱Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International
會議地點Taipei, Taiwan
摘要Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.
關鍵字
語言英文
收錄於
會議性質國際
校內研討會地點
研討會時間20091021~20091023
通訊作者
國別中華民國
公開徵稿Y
出版型式
出處Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.328-335
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