教師資料查詢 | 類別: 會議論文 | 教師: 楊龍杰 Yang Lung-jieh (瀏覽個人網頁)

標題:Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining
學年88
學期1
發表日期1999/11/25
作品名稱Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining
作品名稱(其他語言)
著者Yang, Lung-Jieh; Chen, Ming-Cheng; Chang, Chin-Jung
作品所屬單位淡江大學機械與機電工程學系
出版者
會議名稱1999年中華民國電子材料與元件研討會
會議地點桃園縣, 臺灣
摘要This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer replaces the role of the silicon wafer. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the {111} surfaces. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing principles and the different techniques of membrane machining. The on-chip circuitry of sensors could be also preserved. Another important issue is that the surface-machining-like membrane now is mono-crystalline, which means the stable mechanical properties and reproducible characteristics. This new strategy practically augmented the mass production of piezoresistive pressure sensors. The 1.0mm X 0.8mm X 0.5mm of sensor size with chip density exceeds 5,000 per 4-inch wafer was successfully fabricated.
關鍵字微壓力感測器;微加工;矽晶圓;壓電阻率;Micro Pressure Sensor;Micromaching;Silicon Wafer;Piezoresistivity
語言
收錄於
會議性質國內
校內研討會地點
研討會時間19991125~19991126
通訊作者
國別中華民國
公開徵稿Y
出版型式紙本
出處1999年中華民國電子材料與元件研討會論文集頁581-584
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