教師資料查詢 | 類別: 期刊論文 | 教師: 葉正濤 YEH, JEN-TAUT (瀏覽個人網頁)

標題:Effect of weak reductant on properties of electroless copper polyacrylonitrile nanocomposites for electromagnetic interference shielding
學年98
學期2
出版(發表)日期2010/05/27
作品名稱Effect of weak reductant on properties of electroless copper polyacrylonitrile nanocomposites for electromagnetic interference shielding
作品名稱(其他語言)
著者Tsao, Keng-Yu; Chen, Chang-Cheng; Huang, Chi-Yuan; Tsai, Ching-Shan; Yang, Sung-Yeng; Yeh, Jen-Taut; Chen , Kan-Nan
單位淡江大學化學學系
出版者Hoboken: John Wiley & Sons, Inc.
著錄名稱、卷期、頁數Journal of Applied Polymer Science 118(2), pp. 936-942
摘要In this work, the electroless copper method with different reductant compositions (NaHSO3/Na2 S2O3·5H2O and Na2S2O3·5H2O) without sensitizing and activating, was used to deposit copper-sulfide deposition on the polyacrylonitrile (PAN) surface for electromagnetic interference (EMI) shielding materials. The weak reductant, NaHSO3, in the electroless copper method was used to control the phase of copper-sulfide deposition. The Cux(x=1–1.8)S was deposited on the PAN (CuxS-PAN) by reductant composition (NaHSO3/Na2S2O3·5H2O) and the Cux(x=1–1.8)S deposition of CuxS-PAN possesses three kinds of copper-sulfide phases (CuS, Cu1.75S and Cu1.8S). However, the electroless copper with reductant was only Na2S2O3·5H2O (without weak reductant, NaHSO3), the hexagonal CuS deposition was plated on the PAN (CuS-PAN) and increased the EMI shielding effectiveness of CuS-PAN composites about 10–15 dB. In this study, the best EMI SE of CuS-PAN and CuxS-PAN composites were about 27–30 dB and 15–17 dB respectively, as the cupric ion concentration was 0.24 M. The volume resistivity of CuS-PAN composite was about 1000 times lower than that of CuxS-PAN composite and lowest volume resistivity of CuS-PAN composites was 0.012 Ω cm, as the cupric ion concentration was 0.24 M.
關鍵字EMI;electroless;CuS;polyacrylonitrile
語言英文
ISSN0021-8995
期刊性質國外
收錄於SCI;EI
產學合作
通訊作者Huang, Chi-Yuan
審稿制度
國別美國
公開徵稿
出版型式紙本
相關連結
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