教師資料查詢 | 類別: 期刊論文 | 教師: 蔡子萱 TZU-HSUAN TSAI (瀏覽個人網頁)

標題:Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing
學年94
學期2
出版(發表)日期2006/06/01
作品名稱Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing
作品名稱(其他語言)
著者Tsai, Tzu-hsuan; Wu, Y. F.
單位淡江大學化學工程與材料工程學系
出版者Philadelphia: Taylor & Francis Inc.
著錄名稱、卷期、頁數Chemical Engineering Communications 193 (6), pp.702-714
摘要During copper chemical mechanical polishing (Cu-CMP), the physical properties of slurry, such as the dispersion and suspension stability of abrasives, the interaction between particles and the polished surface, and the rheological characteristics, greatly affect the planarization efficiency. In this study, several nonionic surfactants were added to change the aforementioned physical characteristics of slurry and Cu-CMP performance. Their effects were investigated. The experimental results showed that Al2O3 slurry with 300 ppm Triton DF-16 could enhance the wettability of the Cu surface and stabilize the dispersion of abrasives in the slurry. Therefore, the passivation reaction on the Cu surface during CMP would occur uniformly, and the removal of particles during post cleaning could be improved. Cu CMP using the slurry with an adequate amount of nonionic surfactants, Triton DF-16, is proposed to reduce the surface roughness, enhancing the planarity.
關鍵字Chemical mechanical polishing;Copper;Nonionic surfactant;Stability;Viscosity;Wettability
語言英文
ISSN0098-6445
期刊性質國外
收錄於SCI;SSCI;EI
產學合作
通訊作者Wu, Y. F.
審稿制度
國別美國
公開徵稿
出版型式紙本
相關連結
Google+ 推薦功能,讓全世界都能看到您的推薦!