教師資料查詢 | 類別: 期刊論文 | 教師: 蔡子萱 TZU-HSUAN TSAI (瀏覽個人網頁)

標題:A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy
學年91
學期2
出版(發表)日期2003/05/01
作品名稱A study of copper chemical mechanical polishing in urea–hydrogen peroxide slurry by electrochemical impedance spectroscopy
作品名稱(其他語言)
著者Tsai, Tzu-hsuan; Wu, Yung-fu; Yen, Shi-chern
單位淡江大學化學工程與材料工程學系
出版者Amsterdam: Elsevier BV * North-Holland
著錄名稱、卷期、頁數Applied Surface Science 214(1-4), pp.120-135
摘要The electrochemical impedance spectroscopy (EIS) technique has been used to investigate the feasibility of urea–hydrogen peroxide (urea–H2O2) slurries in copper chemical mechanical polishing (Cu CMP). The performance of the inhibiting-type and the chelating-type additives, BTA and NH4OH, were also explored. In order to analyze the surface-reaction characteristics of Cu, the equivalent circuit of double capacitor mode was mainly used to simulate the corrosion behaviors of Cu CMP in various slurries. In addition, via measuring dc potentiodynamic curves and open circuit potential (OCP), the corrosion characteristics were obtained in various slurries. Both EIS and AFM experimental results indicate that the slurry composed of 5 wt.% urea–H2O2+0.1 wt.% BTA+1 wt.% NH4OH can achieve the better Cu CMP performance. Its rms-roughness (Rq) after CMP and the removal rate (RR) attain to 2.636 nm and 552.49 nm/min, respectively.
關鍵字Copper;Chemical mechanical polishing;Urea-hydrogen peroxide slurry;Electrochemical impedance spectroscopy;Potentiodynamic curve
語言英文
ISSN0169-4332
期刊性質國外
收錄於SCI;EI;SSCI
產學合作
通訊作者Yen, Shi-chern
審稿制度
國別荷蘭
公開徵稿
出版型式紙本
相關連結
Google+ 推薦功能,讓全世界都能看到您的推薦!