|標題：Experimental investigation of silver nano-fluid on heat pipe thermal performance|
|作品名稱||Experimental investigation of silver nano-fluid on heat pipe thermal performance|
|著者||Kang, Shung-wen; Wei, Wei-Chiang; Tsai, Sheng-Hong; Yang, Shih-Yu|
|著錄名稱、卷期、頁數||Applied Thermal Engineering 26(17-18), pp.2377-2382|
|摘要||Nano-fluid is employed as the working medium for a conventional 211 μm wide × 217 μm deep grooved circular heat pipe. The nano-fluid used in this study is an aqueous solution of 35 nm diameter silver nano-particles. The experiment was performed to measure the temperature distribution and to compare the heat pipe thermal resistance using nano-fluid and DI-water. The tested nano-particle concentrations ranged from 1 mg/l to 100 mg/l. The condenser section of the heat pipe was attached to a heat sink that was cooled by water supplied from a constant-temperature bath maintained at 40 °C.|
At a same charge volume, the measured nano-fluid filled heat pipe temperature distribution demonstrated that the thermal resistance decreased 10–80% compared to DI-water at an input power of 30–60 W. The measured results also show that the thermal resistances of the heat pipe decrease as the silver nano-particle size and concentration increase.
|關鍵字||Nano-fluid;Heat pipe;Thermal resistance|