教師資料查詢 | 類別: 會議論文 | 教師: 李經綸 Li Ching-lun (瀏覽個人網頁)

標題:Study of Thickness and Grain Size Effects on Material Behavior in Micro Forming
學年96
學期1
發表日期2007/10/07
作品名稱Study of Thickness and Grain Size Effects on Material Behavior in Micro Forming
作品名稱(其他語言)
著者Yeh, Fung-Huei; Li, Ching-Lun; Lu, Yuung-Hwa
作品所屬單位淡江大學機械與機電工程學系
出版者Daejeon: The Korea Advanced Institute of Science and Technology
會議名稱The 10th International Conference on Advances in Materials and Processing Technologies (AMPT2007)
會議地點Daejeon, KOREA
摘要With the development of the technology, miniature and portability become the trends in manufacturing business. It is more and more important to miniaturize blank size in micro-forming process as well. Therefore, the researchers of micro-forming focus on this trend and try their best to study the problems and find the best solution. This paper presents an effective and practical mathematical modeling to describe the material behavior of any thickness and any grain size in micro-forming. Using this modeling, the cylindrical micro-cup deep drawing is analyzed by explicit dynamic finite element method. The simulation results show that thickness variety and stress distribution are reasonable. This investigation proves that the new mathematical modeling of material behavior will supply a useful modeling which takes into account the thickness and grain size effects in micro-forming.
關鍵字thickness;grain size;material behavior;micro-forming
語言英文
收錄於
會議性質國際
校內研討會地點
研討會時間20071007~20071011
通訊作者
國別韓國
公開徵稿Y
出版型式
出處Proceedings of 10th International Conference on Advances in Materials and Processing Technologies (AMPT2007), 5p.
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