教師資料查詢 | 類別: 期刊論文 | 教師: 陳幹男 CHEN KAN-NAN (瀏覽個人網頁)

標題:The copper sulfide coating on polyacrylonitrile with a chelating agent of ethylenediaminetetraacetic acid by an electroless deposition method and its EMI shielding effectiveness
學年98
學期1
出版(發表)日期2010/01/01
作品名稱The copper sulfide coating on polyacrylonitrile with a chelating agent of ethylenediaminetetraacetic acid by an electroless deposition method and its EMI shielding effectiveness
作品名稱(其他語言)
著者Chen, Yen-Hung; Huang, Chi-Yuan; Roan, Ming-Lih; Lai, Fu-Der; Chen, Kan-Nan; Yeh, Jen-Taut
單位淡江大學化學學系
出版者Hoboken: John Wiley & Sons, Inc.
著錄名稱、卷期、頁數Journal of Applied Polymer Science 115(1), pp.570–578
摘要In this study, a copper sulfide layer was instantaneously coated on the polyacrylonitrile (PAN) by an electroless plating method with the reduction agents NaHSO3 and Na2S2O3·5H2O and a chelating agent (ethylenediaminetetraacetic acid, EDTA). A variety of concentrations of EDTA was added to obtain the anchoring effect and chelating effect in the electroless plating bath. The mechanism of the Cux(x = 1, 2)S growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate was residual in PAN substrate would be purged due to the swelling effect by EDTA solution. Then, the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and the chelating agent. Consequently, the copper sulfide layer deposited successfully by the electroless plating reacted upon EDTA. The swelling degree (Sd) was proposed and evaluated from the FTIR spectra. The relationship between swelling degree of the PAN composite and EDTA concentration (C) is expressed as follows: Sd = 0.13 + 0.90 × e(−15.15C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 to 383 nm when the concentration of EDTA increased from 0.00 to 0.20M. For this reason, the EMI SE of the composites increased from 10–12 dB to 20–23 dB. The GIA-XRD and laser Raman analysis indicated that the deposited layer consisted of CuS and Cu2S.
關鍵字films; nanocomposites; swelling;copper sulfide; electroless; PAN
語言英文
ISSN1097-4628
期刊性質國外
收錄於SCI;EI
產學合作
通訊作者Huang, Chi-Yuan
審稿制度
國別美國
公開徵稿
出版型式電子版
相關連結
Google+ 推薦功能,讓全世界都能看到您的推薦!