High Power Led Lighting Assembly Assembled With Heat Radiation Module With Heat Pipe
學年 97
學期 1
專利開始日期 2008-10-01
專利結束日期 2008-10-01
作品名稱 High Power Led Lighting Assembly Assembled With Heat Radiation Module With Heat Pipe
作品名稱（其他語言） 高功率發光二極體照明燈具與其散熱模組
著者 康尚文; Kang, Shung-wen; Tsai, Meng-chang; Chien, Kun-cheng
單位 淡江大學機械與機電工程學系
著錄名稱、卷期、頁數
描述 專利國別：日本 專利公開/公告號：2008-243780 Application number: 2007-086906 國際分類號：F21V 29/00; F21S 8/04; H01L 33/00; F21Y 101/02
摘要 PROBLEM TO BE SOLVED: To provide a high power light-emitting diode (LED) lighting assembly. SOLUTION: The high power light-emitting diode (LED) lighting assembly assembling a heat radiation module is provided. A heat exchange base section, at least one LED array, at least one heat pipe, and the heat radiation module are included in the LED lighting assembly. At least one LED array surface for mounting the LED array and at least one hollow section for inserting the heat pipe are included in the heat exchange base section. The LED array is arranged on the LED array surface at a designated projecting angle. A heating section, a cooling section, and a conductive section are included in the heat pipe, and operating fluid is filled in the heat pipe. The heat exchange base section is mounted on the heating section, and the heat radiation module is mounted on the cooling section. Heat energy generated by an LED is conducted into the heating section of the heat pipe from the heat exchange base section, whereby, the operating fluid of the heat pipe is heated and evaporated, and flows to radiate heat from the conductive section to the cooling section in the heat radiation module.
關鍵字
語言 jp
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