教師資料查詢 | 類別: 期刊論文 | 教師: 賴偉淇 Lai,Wei-chi (瀏覽個人網頁)

標題:Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process
學年98
學期1
出版(發表)日期2009/11/01
作品名稱Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process
作品名稱(其他語言)
著者Huang, Shu-Hui; Don, Trong-Ming; Lai, Wei-Chi; Chen, Ching-Chung; Cheng, Liao-Ping
單位淡江大學化學工程與材料工程學系
出版者Hoboken: John Wiley & Sons, Inc.
著錄名稱、卷期、頁數Journal of Applied Polymer Science 114(4), pp.2019-2029
摘要The sol-gel method was employed to synthesize an inorganic–organic photosensitive composite material, silica/polyimide. Silica was covalently bonded to polyimide by introduction of 1,4-aminophenol as a coupling agent. A photosensitive cross-linking agent, 2-(dimethylamino) ethyl methacrylate, was used to engender UV sensitivity to the composite. Using field emission scanning electron microscope imaging at very high magnifications, the composite film was found to exhibit a porous cross-sectional structure. The pores were interconnected to form numerous continuous channels within the matrix and silica particles were attached to the pore wall of the polyimide host. Depending on the preparation conditions, the size of the silica particles could vary from 20 nm to a few μm. The thermal degradation temperatures, dynamic mechanical properties, glass transition temperatures, thermal expansion coefficients, and dielectric constants of various silica/polyimide composites were measured, and the results indicated that incorporation of silica could improve the thermal and dimensional stabilities of the polyimide. Also, because the silica/polyimide composite had a porous interior structure, it had a rather low dielectric constant with the lowest achievable value being 1.82.
關鍵字composites; dielectric properties; silicas; polyimides; morphology
語言英文
ISSN1097-4628
期刊性質國外
收錄於SCI;EI
產學合作
通訊作者Cheng, Liao-Ping
審稿制度
國別美國
公開徵稿
出版型式電子版
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