教師資料查詢 | 類別: 專利 | 教師: 趙崇禮 CHAO CHOUNG-LII (瀏覽個人網頁)

標題:Hot embossing auto-leveling apparatus and method
學年91
學期2
專利開始日期2003/03/20
專利結束日期2003/03/20
作品名稱Hot embossing auto-leveling apparatus and method
作品名稱(其他語言)
著者趙崇禮; Chao, Choung-lii; Huang; Jung-yan; Tsai, Chu-shu; Mu, Chuan-kang; Yang, Jauh-jung; Huang, Cheng-chun ; Liu, Ming-yueh
單位淡江大學機械與機電工程學系
著錄名稱、卷期、頁數
描述United States Patent: 7,114,941;Application number: 10/393,891;國際分類號B29C 59/02;專利國別美國
摘要A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
關鍵字
語言英文
相關連結
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