Hot embossing auto-leveling apparatus and method
學年 91
學期 2
專利開始日期 2003-03-20
專利結束日期 2003-03-20
作品名稱 Hot embossing auto-leveling apparatus and method
作品名稱（其他語言）
著者 趙崇禮; Chao, Choung-lii; Huang; Jung-yan; Tsai, Chu-shu; Mu, Chuan-kang; Yang, Jauh-jung; Huang, Cheng-chun ; Liu, Ming-yueh
單位 淡江大學機械與機電工程學系
著錄名稱、卷期、頁數
描述 United States Patent: 7,114,941 Application number: 10/393,891 國際分類號：B29C 59/02 專利國別：美國
摘要 A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
關鍵字
語言 en
相關連結

機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/53861 )

機構典藏連結
SDGS 產業創新與基礎設施