|
摘要
|
Low-temperature solder is needed for temperature-sensitive components, step soldering and wearable devices. Low-temperature bonding is effective for
reducing temperature and manufacturing costs. Indium has a low melting point, low resistance and good anticorrosion properties. Indium plays important roles in transparent conductors, the aerospace industry and flexible displays. Solid–liquid interdiffusion (SLID) bonding is one of the most reliable 3D integration technologies. The microstructure of the Cu/In/Ni bonding interface was
investigated in this study. A low temperature of 180 C was used for SLID bonding. Cu-In compounds, Cu11In9 and CuIn2, were formed after SLID
bonding at 180 C and storing at room temperature. The reaction between Cu and In is fast, even at room temperature. The low-temperature CuIn2 phase is
undoubtedly worth investigating for solder joints. |