教師資料查詢 | 類別: 期刊論文 | 教師: 王儀雯 WANG, YI-WUN (瀏覽個人網頁)

標題:Effects of Surface Diffusion and Solder Volume on Porous-Type Cu3Sn in Cu/Sn/Cu Microjoints
學年
學期
出版(發表)日期2022/01/01
作品名稱Effects of Surface Diffusion and Solder Volume on Porous-Type Cu3Sn in Cu/Sn/Cu Microjoints
作品名稱(其他語言)
著者Y.W. Wang
單位
出版者
著錄名稱、卷期、頁數Materials Chemistry and Physics 275, 125307(4 pages)
摘要High-density interconnection technology is critical for semiconductor packages, which require high speed and multifunctional demands. The shrinkage of solder volume is needed for the miniaturization of devices. Fewer studies investigate using Cu3Sn than Cu6Sn5 in large solder joints. However, Cu3Sn has a significant and critical effect on microjoints. Cu6Sn5 can transform completely to Cu3Sn, which may cause unexpected problems in microjoints. The interfacial reactions in large and small solder joints are different. Porous-type Cu3Sn is an unusual structure at the interface. In this study, we utilize the transient liquid-phase bonding (TLP) process on microbumps to drive the transformation of Cu6Sn5 to Cu3Sn. Porous-type Cu3Sn is loose and unfavorable for joint strength. High-temperature bonding, microbumps and flux residues induce porous structure formation.
關鍵字Semiconductor package;Microjoint;Porous-type Cu3Sn
語言英文
ISSN
期刊性質國外
收錄於SCI;
產學合作
通訊作者Y.W.Wang (王儀雯)
審稿制度
國別中華民國
公開徵稿
出版型式,電子版
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