期刊論文
| 學年 | 103 |
|---|---|
| 學期 | 2 |
| 出版（發表）日期 | 2015-07-01 |
| 作品名稱 | On the Performance of Microstrip Antenna Embedded in Composite Laminated Substrates |
| 作品名稱（其他語言） | |
| 著者 | Yang, S. M.; Hung, C.-C. |
| 單位 | |
| 出版者 | |
| 著錄名稱、卷期、頁數 | International Journal of Numerical Modelling: Electronic Networks, Devices and Fields 28(4), p.371-380 |
| 摘要 | Fiber-reinforced composite structures can be tailored to desire mechanical properties and to embed microstrip antenna in aerospace applications. The electromagnetic characteristics of a microstrip antenna on isotropic and uniaxial substrates have been known, but that embedded in composite laminated substrates remain unavailable to date. This work aims at analyzing the performance of microstrip antenna embedded in composite laminated substrates by spectral domain analysis. Parameter studies are conducted to investigate the effects of the substrate’s dielectric constants, the fiber directions (the orientation between the antenna and the laminate layers), and the stacking sequence on antenna’s resonant frequency and radiation pattern. The antenna size when embedded in composite laminated substrates is larger than that when attached on isotropic substrates, or conversely, the resonant frequency will deviate lower if assuming the substrate as isotropic. The far-field pattern in composite laminated substrates is more ‘directional’ than that in isotropic substrates. The antenna gain in the substrates of symmetric stacking with ±45° fiber direction is 20 dB better than that in isotropic substrates in some elevations. |
| 關鍵字 | spectral domain;microstrip antenna;composite materials;smart materials |
| 語言 | en |
| ISSN | 0894-3370 |
| 期刊性質 | 國外 |
| 收錄於 | SCI EI |
| 產學合作 | |
| 通訊作者 | |
| 審稿制度 | 是 |
| 國別 | USA |
| 公開徵稿 | |
| 出版型式 | ,電子版,紙本 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/113612 ) |