期刊論文
| 學年 | 96 |
|---|---|
| 學期 | 1 |
| 出版（發表）日期 | 2007-11-12 |
| 作品名稱 | Pad Conditioning Density Distribution in CMP Process With Diamond Dresser |
| 作品名稱（其他語言） | |
| 著者 | Feng, Tyan |
| 單位 | |
| 出版者 | |
| 著錄名稱、卷期、頁數 | IEEE Transactions on Semiconductor Manufacturing 20(4), 464-475 |
| 摘要 | In the chemical-mechanical polishing (CMP) process, the pad conditioning density distribution plays a crucial role in the pad wear. A precise model and detailed analysis of a conditioning density function are required. To this end, at first we construct the mathematical model of polishing trajectories on the pad, then under the assumptions that the diamond grains are uniformly distributed and a slow sweeping motion is applied during dressing, the conditioning density distribution for a pad in CMP process is determined. This conditioning density function is verified through numerous numerical examples. In the mean time, it was also observed that to have a flat distribution of pad wear rate we have to make the ratio of disk-radius to pad-radius small, and the effect of the pattern of grain distribution on conditioning density function is insignificant, which agrees with known results from literature. |
| 關鍵字 | Chemical–mechanical polishing (CMP);Preston equation;conditioning density;diamond dresser;pad dressing |
| 語言 | zh_TW |
| ISSN | 0894-6507 |
| 期刊性質 | 國內 |
| 收錄於 | |
| 產學合作 | |
| 通訊作者 | |
| 審稿制度 | 0 |
| 國別 | TWN |
| 公開徵稿 | |
| 出版型式 | ,電子版 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/106307 ) |