期刊論文
| 學年 | 88 |
|---|---|
| 學期 | 2 |
| 出版（發表）日期 | 2000-05-01 |
| 作品名稱 | Improvement of thickness uniformity in nickel electroforming for the LIGA process |
| 作品名稱（其他語言） | |
| 著者 | Yang, Hsiharng; 康尚文; Kang, Shung-wen |
| 單位 | 淡江大學機械與機電工程學系 |
| 出版者 | Elsevier |
| 著錄名稱、卷期、頁數 | international journal of machine tools and manufacture 40(7), pp.1065-1072 |
| 摘要 | An effective method to improve thickness uniformity in nickel electroforming for the LIGA process to produce metallic microstructures is described. The deposited metal distribution is naturally a concave shape over the whole area of the plating base proved by experiments. The edge thickness of the plating area is usually twice or higher than the center of the plating area. A secondary cathode (guard ring) was applied to improve the electroform uniformity. The experimental result of a Joule–Thomson micro-cooler proved its feasibility. The thickness ratio of edge to center of a 500 μm sample decreased from 2.5 to 1.4. The thickness uniformity improvement is achieved without a loss in plating rate in the center of the features. |
| 關鍵字 | Thickness uniformity; Nickel electroforming; LIGA; Metallic microstructures |
| 語言 | en |
| ISSN | 0890-6955 |
| 期刊性質 | 國內 |
| 收錄於 | |
| 產學合作 | |
| 通訊作者 | |
| 審稿制度 | 否 |
| 國別 | TWN |
| 公開徵稿 | |
| 出版型式 | ,電子版 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/45808 ) |