會議論文
| 學年 | 93 |
|---|---|
| 學期 | 2 |
| 發表日期 | 2005-06-08 |
| 作品名稱 | Non-Uniformity of Wafer and Pad in CMP: Kinematic Aspects of View |
| 作品名稱（其他語言） | |
| 著者 | Tyan, Feng |
| 作品所屬單位 | 淡江大學航空太空工程學系 |
| 出版者 | |
| 會議名稱 | American Control Conference 2005 (ACC 2005) |
| 會議地點 | Portland, USA |
| 摘要 | In this paper, we analyze the non-uniformity of sliding distance on both wafer and polishing pad from kinematic point of view. Using the Fourier series expansion, we can show that in steady state the non-uniformity is determined by the ratio between rotary speeds of platen and wafer carrier (m), and the ratio of wafer radius to the distance between the center of platen and wafer (Rc/d). In general, the non-uniformity of wafer increases with |m| and Rc/d. An important observation for polishing pad is that in two particular ranges of the ratio m, the larger Rc/d produces the smaller non-uniformity. Then a ring type polishing pad is proposed for the purpose of improving the non-uniformity of both wafer and pad. However, it turns out that the result is much worse than we expected. |
| 關鍵字 | |
| 語言 | en |
| 收錄於 | |
| 會議性質 | 國際 |
| 校內研討會地點 | |
| 研討會時間 | 20050608~20050610 |
| 通訊作者 | |
| 國別 | USA |
| 公開徵稿 | Y |
| 出版型式 | |
| 出處 | American Control Conference, 2005. Proceedings of the 2005, v.3, pp.2046-2051 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/62477 ) |