會議論文
| 學年 | 98 |
|---|---|
| 學期 | 1 |
| 發表日期 | 2009-10-21 |
| 作品名稱 | Development of Thermal Spreading Technology Nowadays |
| 作品名稱（其他語言） | |
| 著者 | Kang, Shung-wen; Tsai, Meng-chang; Weng, Ming-tai; Hsu, Chao-hsiang |
| 作品所屬單位 | 淡江大學機械與機電工程學系 |
| 出版者 | IEEE COMPONENTS, PACKAGING, & MANUFACTURING TECHNOLOGY SOCIETY (IEEE CPMT-Taipei) |
| 會議名稱 | Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International |
| 會議地點 | Taipei, Taiwan |
| 摘要 | Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented. |
| 關鍵字 | |
| 語言 | en |
| 收錄於 | |
| 會議性質 | 國際 |
| 校內研討會地點 | |
| 研討會時間 | 20091021~20091023 |
| 通訊作者 | |
| 國別 | TWN |
| 公開徵稿 | Y |
| 出版型式 | |
| 出處 | Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.328-335 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/70732 ) |