期刊論文
| 學年 | 98 |
|---|---|
| 學期 | 1 |
| 出版（發表）日期 | 2009-11-01 |
| 作品名稱 | Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process |
| 作品名稱（其他語言） | |
| 著者 | Huang, Shu-Hui; Don, Trong-Ming; Lai, Wei-Chi; Chen, Ching-Chung; Cheng, Liao-Ping |
| 單位 | 淡江大學化學工程與材料工程學系 |
| 出版者 | Hoboken: John Wiley & Sons, Inc. |
| 著錄名稱、卷期、頁數 | Journal of Applied Polymer Science 114(4), pp.2019-2029 |
| 摘要 | The sol-gel method was employed to synthesize an inorganic–organic photosensitive composite material, silica/polyimide. Silica was covalently bonded to polyimide by introduction of 1,4-aminophenol as a coupling agent. A photosensitive cross-linking agent, 2-(dimethylamino) ethyl methacrylate, was used to engender UV sensitivity to the composite. Using field emission scanning electron microscope imaging at very high magnifications, the composite film was found to exhibit a porous cross-sectional structure. The pores were interconnected to form numerous continuous channels within the matrix and silica particles were attached to the pore wall of the polyimide host. Depending on the preparation conditions, the size of the silica particles could vary from 20 nm to a few μm. The thermal degradation temperatures, dynamic mechanical properties, glass transition temperatures, thermal expansion coefficients, and dielectric constants of various silica/polyimide composites were measured, and the results indicated that incorporation of silica could improve the thermal and dimensional stabilities of the polyimide. Also, because the silica/polyimide composite had a porous interior structure, it had a rather low dielectric constant with the lowest achievable value being 1.82. |
| 關鍵字 | composites; dielectric properties; silicas; polyimides; morphology |
| 語言 | en |
| ISSN | 1097-4628 |
| 期刊性質 | 國外 |
| 收錄於 | SCI EI |
| 產學合作 | |
| 通訊作者 | Cheng, Liao-Ping |
| 審稿制度 | |
| 國別 | USA |
| 公開徵稿 | |
| 出版型式 | 電子版 |
| 相關連結 |
機構典藏連結 ( http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/53719 ) |