期刊論文

標題 Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process
學年 98
學期 1
出版(發表)日期 2009/11/01
作品名稱 Porous structure and thermal stability of photosensitive silica/polyimide composites prepared by sol-gel process
作品名稱(其他語言)
著者 Huang, Shu-Hui; Don, Trong-Ming; Lai, Wei-Chi; Chen, Ching-Chung; Cheng, Liao-Ping
單位 淡江大學化學工程與材料工程學系
出版者 Hoboken: John Wiley & Sons, Inc.
著錄名稱、卷期、頁數 Journal of Applied Polymer Science 114(4), pp.2019-2029
摘要 The sol-gel method was employed to synthesize an inorganic–organic photosensitive composite material, silica/polyimide. Silica was covalently bonded to polyimide by introduction of 1,4-aminophenol as a coupling agent. A photosensitive cross-linking agent, 2-(dimethylamino) ethyl methacrylate, was used to engender UV sensitivity to the composite. Using field emission scanning electron microscope imaging at very high magnifications, the composite film was found to exhibit a porous cross-sectional structure. The pores were interconnected to form numerous continuous channels within the matrix and silica particles were attached to the pore wall of the polyimide host. Depending on the preparation conditions, the size of the silica particles could vary from 20 nm to a few μm. The thermal degradation temperatures, dynamic mechanical properties, glass transition temperatures, thermal expansion coefficients, and dielectric constants of various silica/polyimide composites were measured, and the results indicated that incorporation of silica could improve the thermal and dimensional stabilities of the polyimide. Also, because the silica/polyimide composite had a porous interior structure, it had a rather low dielectric constant with the lowest achievable value being 1.82.
關鍵字 composites; dielectric properties; silicas; polyimides; morphology
語言 英文
ISSN 1097-4628
期刊性質 國外
收錄於 SCI;EI
產學合作
通訊作者 Cheng, Liao-Ping
審稿制度
國別 美國
公開徵稿
出版型式 電子版