關鍵字查詢 | 類別:會議論文 | | 關鍵字:Micro Pressure Sensors of 50 μm Size Fabricated by a Standard CMOS Foundry and a Novel Post Process

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序號 學年期 教師動態
1 94/1 機電系 楊龍杰 教授 會議論文 發佈 Micro Pressure Sensors of 50 μm Size Fabricated by a Standard CMOS Foundry and a Novel Post Process , [94-1] :Micro Pressure Sensors of 50 μm Size Fabricated by a Standard CMOS Foundry and a Novel Post Process會議論文Micro Pressure Sensors of 50 μm Size Fabricated by a Standard CMOS Foundry and a Novel Post ProcessWang, Hsin-hsiung; Hsu, Chun-wei; Liao, Wei-hao; 楊龍杰; Yang, Lung-jieh; Dai, Ching-liang淡江大學機械與機電工程學系Piscataway: Institute of Electrical and Electronics Engineers (IEEE)Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on, pp.578-581This paper describes a piezoresistive micro pressure sensor with a size of 50μm made by a standard CMOS foundry and a novel post process. The material of the sensor diaphragm is silicon dioxide, and the piezoresistors are made by polysilicon. For releasing the diaphragms of the micro pressure sensors, this work proposes to use the front-side etching technique with etching holes of 5μm×5μm only. Finally, we use one of the protein stuffs, gelatin, to seal the etching holes. The sensitivity of the piezoresistive pressu
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