關鍵字查詢 | 類別:會議論文 | | 關鍵字:E-MAC

[第一頁][上頁]1[次頁][最末頁]目前在第 1 頁 / 共有 04 筆查詢結果
序號 學年期 教師動態
1 88/1 機電系 楊龍杰 教授 會議論文 發佈 Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining , [88-1] :Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining會議論文Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk MicromachiningYang, Lung-Jieh; Chen, Ming-Cheng; Chang, Chin-Jung淡江大學機械與機電工程學系微壓力感測器;微加工;矽晶圓;壓電阻率;Micro Pressure Sensor;Micromaching;Silicon Wafer;Piezoresistivity1999年中華民國電子材料與元件研討會論文集,頁581-584長庚大學; 中華民國電子材料與元件協會; 教育部This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer replaces the role of the silicon wafer. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the {111} surfaces. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing
2 88/1 機電系 康尚文 教授 會議論文 發佈 Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining , [88-1] :Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk Micromachining會議論文Micro Pressure Sensor with Sub-mm Size by the Silicon Bulk MicromachiningYang, Lung-Jieh; Chen, Ming-Cheng; Chang, Chin-Jung淡江大學機械與機電工程學系微壓力感測器;微加工;矽晶圓;壓電阻率;Micro Pressure Sensor;Micromaching;Silicon Wafer;Piezoresistivity1999年中華民國電子材料與元件研討會論文集,頁581-584長庚大學; 中華民國電子材料與元件協會; 教育部This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer replaces the role of the silicon wafer. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the {111} surfaces. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing
3 92/1 資訊系 張志勇 教授 會議論文 發佈 E-MAC : An efficient multi-channel MAC protocol for 802.11 , [92-1] :E-MAC : An efficient multi-channel MAC protocol for 802.11會議論文E-MAC : An efficient multi-channel MAC protocol for 802.11張志勇; Chnag, Chih-yung; Chung, W. J.; Chen, C. W.淡江大學資訊工程學系2003 National Computer Symposium (NCS 2003), Taichung, Taiwantku_id:000119258;Made available in DSpace on 2010-01-11T05:36:29Z (GMT). No. of bitstreams: 0en<links><record><name>機構典藏連結</name><url>http://tkuir.lib.tku.edu.tw:8080/dspace/handle/987654321/37520</url></record></links>
4 88/1 機電系 楊龍杰 教授 會議論文 發佈 Micro pressure sensor with submillimeter size by the silicon bulk micromachining , [88-1] :Micro pressure sensor with submillimeter size by the silicon bulk micromachining會議論文Micro pressure sensor with submillimeter size by the silicon bulk micromachining楊龍杰; Yang, Lung-jieh; Chang, Y. M.淡江大學機械與機電工程學系SPIE's symp. on micromachining and microfabrication v.3876-32This paper proposed a new direction for the miniaturization of silicon bulk-machined sensors. Herein, the glass substrate bonded with the silicon wafer substitutes the role of the silicon wafer itself. Then the whole silicon wafer with sensing portions, whatever piezo-resistive or capacitive types, could be all machined to the membrane structure without chip-area wasting on the (111)-face slopes. Basically, the chip size by this semi-SOI method would be as small as the surface-machined one in principle, if the silicon-glass bonding process is guaranteed. The other advantages of this strategy include the process compatibility with the different sensing principles and the different techniques of membrane machining. The o
[第一頁][上頁]1[次頁][最末頁]目前在第 1 頁 / 共有 04 筆查詢結果