Lamination Scheme of Curing Degree at Multiple Levels of Temperature With Location-Scale Regression
學年 109
學期 2
出版（發表）日期 2021-03-26
作品名稱 Lamination Scheme of Curing Degree at Multiple Levels of Temperature With Location-Scale Regression
作品名稱（其他語言）
著者 Tsai, C. C.; Lin, C. T.; Balakrishnan, N.
單位
出版者
著錄名稱、卷期、頁數 IEEE Access 9, p.50163-50169
摘要 Solar power has become a key green source of energy. An important factor that affects the reliability and lifetime of solar modules is the quality of encapsulation through the lamination process, which melts the ethylene vinyl acetate (EVA) to make the solar cells combine with the front glass side and the rear side units. The degree of crosslinking or curing degree for EVA sheets, when the EVA sheet gets heated, can affect the efficiency of the performance and power conversion of solar modules. For this reason, motivated by a lamination data, we construct here a statistical model for describing the relationship between the curing degree and the lamination factors (temperature and time). Then, based on some specification limits on the curing degree, the optimal lamination time for solar modules can be determined at different temperatures. Moreover, the optimal sample size allocation in a test for measuring EVA sheets can also be determined. A simulation study is finally carried out to show the closeness of simulation results to the asymptotic results.
關鍵字 Confidence bands;curing degree;degree of crosslinking;sample size allocation;specification limits
語言 en_US
ISSN 2169-3536
期刊性質 國外
收錄於 SCI
產學合作
通訊作者
審稿制度 是
國別 USA
公開徵稿
出版型式 ,電子版
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