教師資料查詢 | 類別: 期刊論文 | 教師: 田 豐 TYAN FENG (瀏覽個人網頁)

標題:Pad Conditioning Density Distribution in CMP Process With Diamond Dresser
學年96
學期1
出版(發表)日期2007/11/12
作品名稱Pad Conditioning Density Distribution in CMP Process With Diamond Dresser
作品名稱(其他語言)
著者Feng, Tyan
單位
出版者
著錄名稱、卷期、頁數IEEE Transactions on Semiconductor Manufacturing 20(4), 464-475
摘要In the chemical-mechanical polishing (CMP) process, the pad conditioning density distribution plays a crucial role in the pad wear. A precise model and detailed analysis of a conditioning density function are required. To this end, at first we construct the mathematical model of polishing trajectories on the pad, then under the assumptions that the diamond grains are uniformly distributed and a slow sweeping motion is applied during dressing, the conditioning density distribution for a pad in CMP process is determined. This conditioning density function is verified through numerous numerical examples. In the mean time, it was also observed that to have a flat distribution of pad wear rate we have to make the ratio of disk-radius to pad-radius small, and the effect of the pattern of grain distribution on conditioning density function is insignificant, which agrees with known results from literature.
關鍵字Chemical–mechanical polishing (CMP);Preston equation;conditioning density;diamond dresser;pad dressing
語言中文
ISSN0894-6507
期刊性質國內
收錄於
產學合作
通訊作者
審稿制度0
國別中華民國
公開徵稿
出版型式,電子版
相關連結
Google+ 推薦功能,讓全世界都能看到您的推薦!