教師資料查詢 | 類別: 期刊論文 | 教師: 陳幹男 CHEN KAN-NAN (瀏覽個人網頁)

標題:Electroless deposition of the copper sulfide coating on polyacrylonitrile with a chelating agent of triethanolamine and its EMI Shielding Effectiveness
學年97
學期2
出版(發表)日期2009/07/01
作品名稱Electroless deposition of the copper sulfide coating on polyacrylonitrile with a chelating agent of triethanolamine and its EMI Shielding Effectiveness
作品名稱(其他語言)
著者Chen, Yen-hung; Huang, Chi-yuan; Lai, Fu-der; Roan, Ming-lih; Chen, Kan-nan; Yeh, Jen-taut
單位淡江大學化學學系
出版者Lausanne: Elsevier S.A.
著錄名稱、卷期、頁數Thin Solid Films 517(17), pp.4984–4988
摘要In this study, an effective deposition of CuS on PAN film was proposed by an electroless plating method with the reduction agents NaHSO3 and Na2S2O3·5H2O and a chelating agent (triethanolamine, TEA). A variety of concentrations of TEA were added to obtain the anchoring effect and chelating effect in the electroless plating bath. The GIA-XRD and laser Raman analysis indicated that the deposited layer consisted of CuS. The mechanism of the copper sulfide (CuS) growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate remained in PAN substrate would be purged due to the swelling effect by TEA solution. Then the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and TEA. Consequently, the copper sulfide layer was deposited effectively by the electroless plating reaction. The swelling degree (Sd) was proposed and evaluated from the FT-IR spectra. The relationship between swelling degree of the PAN composite and TEA concentration (C) is expressed as: Sd = 0.07 + 1.00 × e^(− 15.15C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 nm to 247 nm when the concentration of TEA increased from 0.00 M to 0.60 M. As a result, the EMI SE of the composites increased from 10–12 dB to 25–27 dB.
關鍵字EMI SE; Electroless plating; Copper sulfide; TEA; Anchoring effect
語言英文
ISSN0040-6090
期刊性質國外
收錄於SCI
產學合作
通訊作者Huang, Chi-yuan
審稿制度
國別瑞士
公開徵稿
出版型式紙本
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